YCS Mini U-Protection Universal BGA Reballing Planting Tin Platform

Features :

✅ Secure clamping for versatile use with a wider range of IC components, including CPUs, hard drives, and font libraries

✅ Anti-slip rubber feet design ensures wear resistance and enhanced stability, facilitating easier maintenance

✅ Easy to remove specialized groove design, both sides are designed with special grooves for removing, a thoughtful experience

✅ Ultra-strong magnetic force, precise fit without peeling off, self-contained precise positioning, and aligning the holes is more convenient