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2UUL PH11 HOT-BLOCK Preheater for Mobile Phone Motherboard PCB Delamination Rebonding
2UUL PH11 HOT-BLOCK Preheater for Mobile Phone Motherboard PCB Delamination Rebonding - Image 2
2UUL PH11 HOT-BLOCK Preheater for Mobile Phone Motherboard PCB Delamination Rebonding - Image 3
2UUL PH11 HOT-BLOCK Preheater for Mobile Phone Motherboard PCB Delamination Rebonding - Image 4
2UUL PH11 HOT-BLOCK Preheater for Mobile Phone Motherboard PCB Delamination Rebonding - Image 5
2UUL PH11 HOT-BLOCK Preheater for Mobile Phone Motherboard PCB Delamination Rebonding - Image 6
2UUL PH11 HOT-BLOCK Preheater for Mobile Phone Motherboard PCB Delamination Rebonding - Image 7

2UUL PH11 HOT-BLOCK Preheater for Mobile Phone Motherboard PCB Delamination Rebonding

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RM 145.00

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ThailandOut of Stock

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