LUOWEI CPU Series BGA Reballing Stencil Set for Qualcomm ( Snapdragon ) 5PCS/SET

SKU: N/A Categories: All Products, New Arrivals Brand: LUOWEI

Price range: RM 12.00 through RM 40.00

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Clear

Please select a variation to see location availability.

Product Gallery

MECHANIC LA-03 Anti-Blowout BGA Reballing Pad for CPU IC Chip Soldering Repair

RM 20.00

MECHANIC LA-03 Anti-Blowout BGA Reballing Pad for CPU IC Chip Soldering Repair

LUOWEI LW-C3 30W RPM 4-Speed Settings High-Power Dust-Removal Fan

RM 58.00

LUOWEI LW-C3 30W RPM 4-Speed Settings High-Power Dust-Removal Fan

2UUL BH30 The Smile JIG Mini Fixture for Mobile Phone Motherboard IC Chip Repair

RM 55.00

2UUL BH30 The Smile JIG Mini Fixture for Mobile Phone Motherboard IC Chip Repair

MaAnt XJ-1 Eagle Eye 4K HD Video Industrial Microscope Camera for Mobile Phone Repair

RM 350.00

MaAnt XJ-1 Eagle Eye 4K HD Video Industrial Microscope Camera for Mobile Phone Repair