Leecomm

Loading...

MIJING M21 Universal Magnetic Base Phone Mid Frame Reballing Tool

Category: Brand:

MiJing M21 universal magnetic base mobile phone motherboard middle layer frame reballing platform. MiJing universal magnetic base with magnetic middle layer steel mesh stencil and scraper blade tin paste knife for cell phone logic board middle layer mid frame BGA Tin planting repair.

Features:

1. Temperature resistance and strong magnetism.

2. Temperature-resistant silicone material, built-in strong magnetism.

3. Suitable for mobile phone motherboard middle layer, middle layer mania, BGA, tin-planting, ect.

RM 95.00

Location Availability

MalaysiaOut of Stock
ThailandOut of Stock

Product Gallery

Related Products

RF4 RF-CS05 Nanoscale Magic Sponge Balls - 500PCS
RF4 RF-CS05 Nanoscale Magic Sponge Balls - 500PCS
RM 10.00
RF4 RF-CS05 Nanoscale Magic Sponge Balls - 500PCS
RF4 RF-CS05 Nanoscale Magic Sponge Balls - 500PCS
2UUL SD92 New Version SCROO Screwdriver 5pcs Set
2UUL SD92 New Version SCROO Screwdriver 5pcs Set
RM 69.00
2UUL SD92 New Version SCROO Screwdriver 5pcs Set
2UUL SD92 New Version SCROO Screwdriver 5pcs Set
MIJING R12 Spring Structure Adaptive-Clamping-Type Chip Glue Removal Fixture
MIJING R12 Spring Structure Adaptive-Clamping-Type Chip Glue Removal Fixture
RM 47.90
MIJING R12 Spring Structure Adaptive-Clamping-Type Chip Glue Removal Fixture
MIJING R12 Spring Structure Adaptive-Clamping-Type Chip Glue Removal Fixture
WL Remove Glue Blade 15 in 1 Rubber For  Motherboard CPU Power IC Glue Removal Tool Stratified Scraping IC Side Glue
WL Remove Glue Blade 15 in 1 Rubber For Motherboard CPU Power IC Glue Removal Tool Stratified Scraping IC Side Glue
RM 29.00
WL Remove Glue Blade 15 in 1 Rubber For  Motherboard CPU Power IC Glue Removal Tool Stratified Scraping IC Side Glue
WL Remove Glue Blade 15 in 1 Rubber For Motherboard CPU Power IC Glue Removal Tool Stratified Scraping IC Side Glue
Scroll to Top