Leecomm

Loading...

MIJING M21 Universal Magnetic Base Phone Mid Frame Reballing Tool

Category: Brand:

MiJing M21 universal magnetic base mobile phone motherboard middle layer frame reballing platform. MiJing universal magnetic base with magnetic middle layer steel mesh stencil and scraper blade tin paste knife for cell phone logic board middle layer mid frame BGA Tin planting repair.

Features:

1. Temperature resistance and strong magnetism.

2. Temperature-resistant silicone material, built-in strong magnetism.

3. Suitable for mobile phone motherboard middle layer, middle layer mania, BGA, tin-planting, ect.

RM 95.00

Location Availability

MalaysiaOut of Stock
ThailandOut of Stock

Product Gallery

Related Products

MECHANIC Aaa-14 / Aaa-15 Ultra Fine High Hardness Stainless Steel Tweezers for Mobile Phone Repair
MECHANIC Aaa-14 / Aaa-15 Ultra Fine High Hardness Stainless Steel Tweezers for Mobile Phone Repair
RM 20.00
MECHANIC Aaa-14 / Aaa-15 Ultra Fine High Hardness Stainless Steel Tweezers for Mobile Phone Repair
MECHANIC Aaa-14 / Aaa-15 Ultra Fine High Hardness Stainless Steel Tweezers for Mobile Phone Repair
WYLIE LCD Screen Frame Glue Removal Blade
WYLIE LCD Screen Frame Glue Removal Blade
RM 8.00
WYLIE LCD Screen Frame Glue Removal Blade
WYLIE LCD Screen Frame Glue Removal Blade
MECHANIC Q60 Flux Paste Powerful Antioxidant Remove Oxidized Layer
MECHANIC Q60 Flux Paste Powerful Antioxidant Remove Oxidized Layer
RM 50.00
MECHANIC Q60 Flux Paste Powerful Antioxidant Remove Oxidized Layer
MECHANIC Q60 Flux Paste Powerful Antioxidant Remove Oxidized Layer
MECHANIC MK1 SE 50mm Large Area Universal Motherboard IC Chip Clamping PCB Repair Fixture
MECHANIC MK1 SE 50mm Large Area Universal Motherboard IC Chip Clamping PCB Repair Fixture
RM 80.00
MECHANIC MK1 SE 50mm Large Area Universal Motherboard IC Chip Clamping PCB Repair Fixture
MECHANIC MK1 SE 50mm Large Area Universal Motherboard IC Chip Clamping PCB Repair Fixture
Scroll to Top