Leecomm

Loading...

MIJING M21 Universal Magnetic Base Phone Mid Frame Reballing Tool

Category: Brand:

MiJing M21 universal magnetic base mobile phone motherboard middle layer frame reballing platform. MiJing universal magnetic base with magnetic middle layer steel mesh stencil and scraper blade tin paste knife for cell phone logic board middle layer mid frame BGA Tin planting repair.

Features:

1. Temperature resistance and strong magnetism.

2. Temperature-resistant silicone material, built-in strong magnetism.

3. Suitable for mobile phone motherboard middle layer, middle layer mania, BGA, tin-planting, ect.

RM 95.00

Location Availability

MalaysiaOut of Stock
ThailandOut of Stock

Product Gallery

Related Products

YCS  4-in-1 Diamond Shield Rear Camera Repair Protective Cover Set for IP 6 - 17 Series
YCS 4-in-1 Diamond Shield Rear Camera Repair Protective Cover Set for IP 6 - 17 Series
RM 20.00
YCS  4-in-1 Diamond Shield Rear Camera Repair Protective Cover Set for IP 6 - 17 Series
YCS 4-in-1 Diamond Shield Rear Camera Repair Protective Cover Set for IP 6 - 17 Series
FORWARD Halogen Free Flux Paste for Mobile Phone BGA PCB Repair
FORWARD Halogen Free Flux Paste for Mobile Phone BGA PCB Repair
Price range: RM 8.00 through RM 11.00
FORWARD Halogen Free Flux Paste for Mobile Phone BGA PCB Repair
FORWARD Halogen Free Flux Paste for Mobile Phone BGA PCB Repair
MIJING GR-10 Multifunctional Speed Adjustable OCA Electric Screen Glue Remover
MIJING GR-10 Multifunctional Speed Adjustable OCA Electric Screen Glue Remover
RM 48.00
MIJING GR-10 Multifunctional Speed Adjustable OCA Electric Screen Glue Remover
MIJING GR-10 Multifunctional Speed Adjustable OCA Electric Screen Glue Remover
2UUL DW15 2015 Ultra Density Solder Vampire Desoldering Wick - 10 Rolls/Box
2UUL DW15 2015 Ultra Density Solder Vampire Desoldering Wick - 10 Rolls/Box
RM 36.00
2UUL DW15 2015 Ultra Density Solder Vampire Desoldering Wick - 10 Rolls/Box
2UUL DW15 2015 Ultra Density Solder Vampire Desoldering Wick - 10 Rolls/Box
Scroll to Top