Leecomm

My Account
Cart
Loading...
YCS-C08 0.8L Ultrasonic Cleaner for Motherboards Glasses Watches Deep Cleaning Repair Tool
YCS-C08 0.8L Ultrasonic Cleaner for Motherboards Glasses Watches Deep Cleaning Repair Tool - Image 2
YCS-C08 0.8L Ultrasonic Cleaner for Motherboards Glasses Watches Deep Cleaning Repair Tool - Image 3
YCS-C08 0.8L Ultrasonic Cleaner for Motherboards Glasses Watches Deep Cleaning Repair Tool - Image 4
YCS-C08 0.8L Ultrasonic Cleaner for Motherboards Glasses Watches Deep Cleaning Repair Tool - Image 5
YCS-C08 0.8L Ultrasonic Cleaner for Motherboards Glasses Watches Deep Cleaning Repair Tool - Image 6
YCS-C08 0.8L Ultrasonic Cleaner for Motherboards Glasses Watches Deep Cleaning Repair Tool - Image 7

YCS-C08 0.8L Ultrasonic Cleaner for Motherboards Glasses Watches Deep Cleaning Repair Tool

Category: Brand:

YCS-C08 0.8L ultrasonic cleaner with countdown display, time gear adjustment, depth standard dual ultrasonic cleaning mode, suitable for mobile phone motherboard, circuit board, camera, CPU/BGA chip, glasses, electronic parts cleaning.

RM 138.00

Location Availability

MalaysiaOut of Stock
ThailandOut of Stock

Product Gallery

1
2
3
4
5
6

Related Products

YCS Multi-Purpose BGA Reballing Stencil for IP / Sam / MTK / Qualcomm
YCS Multi-Purpose BGA Reballing Stencil for IP / Sam / MTK / Qualcomm
RM 20.00
Add to cart
YCS Multi-Purpose BGA Reballing Stencil for IP / Sam / MTK / Qualcomm
YCS Multi-Purpose BGA Reballing Stencil for IP / Sam / MTK / Qualcomm
Add to cart
WYLIE 1.5/2.0/2.5/3.0/3.5mm 3M Desoldering Braid Low Residue
WYLIE 1.5/2.0/2.5/3.0/3.5mm 3M Desoldering Braid Low Residue
Price range: RM 10.00 through RM 15.00
Add to cart
WYLIE 1.5/2.0/2.5/3.0/3.5mm 3M Desoldering Braid Low Residue
WYLIE 1.5/2.0/2.5/3.0/3.5mm 3M Desoldering Braid Low Residue
Add to cart
LUOWEI LW-025 Multi-Functional Mobile Phone Screen Protector Removal Clamp with Suction Cups
LUOWEI LW-025 Multi-Functional Mobile Phone Screen Protector Removal Clamp with Suction Cups
RM 120.00
Add to cart
LUOWEI LW-025 Multi-Functional Mobile Phone Screen Protector Removal Clamp with Suction Cups
LUOWEI LW-025 Multi-Functional Mobile Phone Screen Protector Removal Clamp with Suction Cups
Add to cart
MECHANIC LA-03 Anti-Blowout BGA Reballing Pad for CPU IC Chip Soldering Repair
MECHANIC LA-03 Anti-Blowout BGA Reballing Pad for CPU IC Chip Soldering Repair
RM 20.00
Add to cart
MECHANIC LA-03 Anti-Blowout BGA Reballing Pad for CPU IC Chip Soldering Repair
MECHANIC LA-03 Anti-Blowout BGA Reballing Pad for CPU IC Chip Soldering Repair
Add to cart
Scroll to Top