YCS H03 / H03 MAX Universal Motherboard Chip Ring Fixture for Mobile Phone Soldering Repair

[ YCS H03 ] Features :

– Fully applicable to various types of chips/motherboards

– Removal tin and glue, no need to adjust the direction, travel coaxial movement

– For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife

– Motherboard cleaning doesn’t require adjusting the orientation, clean up at once

– The module is suitable for various sizes of motherboards in all aspects

[ YCS H03 MAX ] Features :

– Larger size, more clamping space, fully applicable to various types of chips/motherboards

– Removal of tin and glue, no need to adjust the direction, travel coaxial movement

– For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife

– Motherboard cleaning doesn’t require adjusting the orientation, clean up at once

– The module is suitable for various sizes of motherboards in all aspects