YCS H03 / H03 MAX Universal Motherboard Chip Ring Fixture for Mobile Phone Soldering Repair
[ YCS H03 ] Features :
– Fully applicable to various types of chips/motherboards
– Removal tin and glue, no need to adjust the direction, travel coaxial movement
– For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife
– Motherboard cleaning doesn’t require adjusting the orientation, clean up at once
– The module is suitable for various sizes of motherboards in all aspects
[ YCS H03 MAX ] Features :
– Larger size, more clamping space, fully applicable to various types of chips/motherboards
– Removal of tin and glue, no need to adjust the direction, travel coaxial movement
– For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife
– Motherboard cleaning doesn’t require adjusting the orientation, clean up at once
– The module is suitable for various sizes of motherboards in all aspects
RM 99.00
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