YCS [ NEW ] Solder Paste 150/183/199℃ Low/Medium/High Temperature Solder Paste

Features :

– No false soldering, no cleaning, fast tin climbing, a wide range of applications.

– Bright and full solder joints, less residue, and various styles to choose from.

– Applicable to engineering circuit repair, PCBA welding, SMT chip, mobile phone motherboard welding QFN, and other maintenance of a wide range of areas

– Bright and full solder joints, high resistance, strong activity, easy to weld, not easy to appear false welding or false welding and other bad phenomena

– The tin paste is sticky and smooth, the viscosity change is small, chip components are not easy to produce offset