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YCS [ NEW ] Solder Paste 150/183/199℃ Low/Medium/High Temperature Solder Paste
Features :
– No false soldering, no cleaning, fast tin climbing, a wide range of applications.
– Bright and full solder joints, less residue, and various styles to choose from.
– Applicable to engineering circuit repair, PCBA welding, SMT chip, mobile phone motherboard welding QFN, and other maintenance of a wide range of areas
– Bright and full solder joints, high resistance, strong activity, easy to weld, not easy to appear false welding or false welding and other bad phenomena
– The tin paste is sticky and smooth, the viscosity change is small, chip components are not easy to produce offset
RM 29.90
Location Availability
Please select a variation to see location availability.
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