Leecomm

Loading...

YCS-P03 Universal Adjustable Parallel Clamp

Category: Brand:

– New style, new clamp design, More suitable for maintenance personnel, more suitable for mobile phone chip motherboard

– New clamp, double plate clamping, stable clamping, alloy base

– Axis spiral design, more stable clamping, The main body and knob are made of frosted durable aluminum alloy, and the spiral shaft design clamps the motherboard firmly and stably

– Same-direction rotation clamping direction, Simple operation design, different from the different rotation methods on the market, the same-direction rotation scheme makes your use more convenient

– New clamp bevel design, Does not hinder the maintenance tool from repairing the side components, which is more suitable for maintenance personnel

RM 80.90

Location Availability

MalaysiaOut of Stock
ThailandOut of Stock

Product Gallery

Related Products

LUOWEI LW-LS04 Stepless Adjustment 6500K Super Bright Lighting Mini Eye Protection Soft Fill Light
LUOWEI LW-LS04 Stepless Adjustment 6500K Super Bright Lighting Mini Eye Protection Soft Fill Light
RM 68.00
LUOWEI LW-LS04 Stepless Adjustment 6500K Super Bright Lighting Mini Eye Protection Soft Fill Light
LUOWEI LW-LS04 Stepless Adjustment 6500K Super Bright Lighting Mini Eye Protection Soft Fill Light
YCS  Solder Paste 150 /183 / 199℃ SMD PCB BGA Repair Syringe Flux ( 35g )
YCS Solder Paste 150 /183 / 199℃ SMD PCB BGA Repair Syringe Flux ( 35g )
RM 29.90
YCS  Solder Paste 150 /183 / 199℃ SMD PCB BGA Repair Syringe Flux ( 35g )
YCS Solder Paste 150 /183 / 199℃ SMD PCB BGA Repair Syringe Flux ( 35g )
MaAnt JX-03 Mechanical Arm 360° Rotating Metal Microscope Swinging Arm for Most Microscope
MaAnt JX-03 Mechanical Arm 360° Rotating Metal Microscope Swinging Arm for Most Microscope
RM 175.00
MaAnt JX-03 Mechanical Arm 360° Rotating Metal Microscope Swinging Arm for Most Microscope
MaAnt JX-03 Mechanical Arm 360° Rotating Metal Microscope Swinging Arm for Most Microscope
MIJING Z22MAX CPU Chip Tin Planting BGA Reballing Stencil Platform for IP 11-17 Series
MIJING Z22MAX CPU Chip Tin Planting BGA Reballing Stencil Platform for IP 11-17 Series
RM 35.00
MIJING Z22MAX CPU Chip Tin Planting BGA Reballing Stencil Platform for IP 11-17 Series
MIJING Z22MAX CPU Chip Tin Planting BGA Reballing Stencil Platform for IP 11-17 Series
Scroll to Top