YCS-SLD01 Dragon ARC Solder Pad 0.3mm/0.45mm/0.77mm IC Slot Heat-Resistant Magnetic Silicone Mat

YCS Tin-planted Dragon ARC Pad Silicone Mat with 0.3mm 0.45mm 0.77mm Chip Slot for mobile phone Hard Disk CPU BGA Chip Soldering Repair. No bubbling, high temperature resistance, strong magnetic tin pad, easy to adsorb tin planting net BGA stencil.

YCS Arc Dragon Pad Features:

1. YCS ARC Pad planting tin silicone mat with 0.3mm 0.45mm 0.77mm slot for mobile phone motherboard CPU NAND Chip BGA reballing soldering repair.

2. Three chip slots in multiple grids meet the tinning of chips of various thicknesses and specifications, and multiple slots are widely used.

3. The strong magnetic adsorption steel mesh will not fall off even if it is thrown wildly. The strong magnetic design makes the steel mesh not easy to fall off and shift, and the tinning is more firm and stable.

4. The heat dissipation holes on the back design prevent the steel mesh from bulging during tinning. The heat dissipation holes design prevents the steel mesh from bulging during tinning, and the strong magnetic adsorption steel mesh is also not easy to shift.