YCS U Platform Universal BGA Reballing Planting Tin Platform

Features :

1. Tight clamping, precise clamping, more stable operation, less likely to damage the chip.

2. High temperature and corrosion resistance, high quality synthetic stone, high strength, anti-fouling and easy to clean.

3. Glue removal, tin implantation, U protection, a good machine multi-purpose, magnetic design, stable and firm, high temperature resistance, durable.

4. Anti-slip rubber foot pads, wear-resistant and anti-slip, enhanced stability, easier maintenance.